The Odisha government on Friday signed a memorandum of understanding (MoU) with technology giant Intel Corporation and 3DGS Inc USA to bring substrate manufacturing technology to India, Union Electronics and IT Minister Ashwini Vaishnaw announced.
Project Details and Investment
The project, with an estimated investment of approximately US$ 3.3 billion (more than Rs 31,600 crore) in Bhubaneswar, represents one of the largest high-technology manufacturing investments in the country, according to a government statement. The facility will focus on advanced packaging glass core substrates and high-density interconnect substrates, with Intel providing technology know-how and process expertise.
Government and Industry Leaders' Remarks
Vaishnaw, in a social media post, wrote, "This will further advance semiconductor ecosystem in India." The Union minister, along with Chief Minister Mohan Charan Majhi and Intel CEO Lip-Bu Tan, witnessed the MoU signing by officials digitally. Vaishnaw said the landmark pact aligns with the Centre's vision to build a comprehensive semiconductor ecosystem.
Employment and Economic Impact
The project will be implemented in phases over five to six years and is expected to generate over 1,800 direct high-skilled jobs, besides significant indirect employment, the statement added. It is expected to boost capability development, ecosystem growth, and export-oriented manufacturing.
Strategic Importance for India's Semiconductor Mission
The initiative complements ongoing efforts under the India Semiconductor Mission to strengthen domestic manufacturing, design capabilities, and supply chains. It could position Odisha among emerging global semiconductor hubs. Substrate manufacturing involves producing base materials for microchip fabrication and packaging, including silicon wafers. With conventional transistor scaling nearing its limits, innovation in advanced packaging and substrate design has become critical to enhancing performance and energy efficiency, especially in artificial intelligence, computing, and communications.
Background and Previous Approvals
Following Union cabinet approval in August last year, 3DGS is setting up a vertically integrated advanced packaging and embedded glass substrate facility at Info Valley in Bhubaneswar with a proposed investment of Rs 1,943 crore. The plant will bring advanced capabilities, including glass interposers with integrated passives, silicon bridges, and 3D heterogeneous integration (3DHI) modules. The development comes amid India's push to strengthen its semiconductor ecosystem, with the Centre approving 12 projects under the India Semiconductor Mission involving investments of about Rs 1.64 lakh crore.
